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RETINA® – DIE mark counterfeit verification on silicon wafer after fully laser decapsulation

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INSTACNC® 2818

$124,900.00 – $169,900.00

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InstaWeld® WD410

$31,900.00

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InstaCut Compact side view

InstaCut® High Power-Compact

$316,000.00 – $473,000.00

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FALIT® – DUO

$111,800.00 – $767,100.00

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Laser de-layering process can precisely remove the RDL, via hole and other MEMS structure to expose the desired inner inspection.

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