RETINA®: Offering solutions for deductive microforming and zero-taper drilling applications, employing short-wavelength and ultrafast laser sources.
CLC’s laser micromachining technology originated from the application of laser micro-drilling on jet engine turbine blades for Pratt Whitney in 1972.
OUR CUSTOMERS
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Lasers configured in RETINA
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Laser Type: DPSS Green Laser
Wavelength (nm): 532
Maximum Output Power (Watt): 10
Frequency Operating Range (kHz): 10-200
Cooling: Air Cooled
Warranted Working Hours: 2 Years or 10,000 hrs, whichever occurs first
Estimated Life Working Hours: 15,000 hrs.
Environment Temperature: 50~95°F (10~35 °C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: DPSS Green Laser
Wavelength (nm): 532
Maximum Output Power (Watt): 25
Frequency Operating Range (kHz): 10-200
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 10,000 hrs, whichever occurs first
Estimated Life Working Hours: 15,000 hrs.
Environment Temperature: 50~95°F (10~35 °C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: Picosecond Pulsed Green Laser
Wavelength (nm): 532
Maximum Output Power (Watt): 20
Frequency Operating Range (kHz): 1-1,000 or 2,000-8,000
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 17,520 (2 x 365 Days, 24 Hours/Day), whichever occurs first
Estimated Life Working Hours: 50,000
Environment Temperature: 59~86°F(15~30°C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: UV Laser
Wavelength (nm): 355 ± 5
Maximum Output Power (Watt): 10
Frequency Operating Range (kHz): 20-200
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 10,000 hrs, whichever occurs first
Estimated Life Working Hours: 15,000
Environment Temperature: 50~95°F (10~35 °C)
Environment Humidity (%): 10~95% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: Picosecond Pulsed UV Laser
Wavelength (nm): 355
Maximum Output Power (Watt): 10
Frequency Operating Range (kHz): 1-1,000 or 2,000-8,000
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 17,520 (2 x 365 Days, 24 Hours/Day), whichever occurs first
Estimated Life Working Hours: 50,000
Environment Temperature: 59~86°F(15~30°C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: Picosecond Pulsed UV Laser
Wavelength (nm): 355
Maximum Output Power (Watt): 20
Frequency Operating Range (kHz): 0-3,000 or 2,000-8,000
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 17,520 (2 x 365 Days, 24 Hours/Day), whichever occurs first
Estimated Life Working Hours: 50,000
Environment Temperature: 59~86°F(15~30°C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: Picosecond Pulsed IR Laser
Wavelength (nm): 1,064
Maximum Output Power (Watt): 50
Frequency Operating Range (kHz): 50-1,000
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 17,520 (2 x 365 Days, 24 Hours/Day), whichever occurs first
Estimated Life Working Hours: 50,000
Environment Temperature: 59~86°F(15~30°C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: Picosecond Pulsed IR Laser
Wavelength (nm): 1064
Maximum Output Power (Watt): 70
Pulse Width (ps): <10
Max Pulse Energy(uj):1-10×200
Cooling: Water Cooled
Polarization: Linear
Output aperature: 2mm
Warranted Working Hours: 2 Years or 17,520 (2 x 365 Days, 24 Hours/Day), whichever occurs first
Estimated Life Working Hours: 50,000
Environment Temperature: 68~86°F(20~30°C)
Environment Humidity (%): 0~50% Non-condensed
Default Lens (EFL, mm): f160
Laser Type: Femtosecond Pulsed IR Laser
Wavelength (nm): 1,040
Maximum Output Power (Watt): 8
Frequency Operating Range (kHz): 200-1,000
Cooling: Water Cooled
Warranted Working Hours: 2 Years or 17,520 (2 x 365 Days, 24 Hours/Day), whichever occurs first
Estimated Life Working Hours: 30,000
Environment Temperature: 64~86°F(18~30°C)
Environment Humidity (%): 0~80% Non-condensed
Default Lens (EFL, mm): f160
RETINA® is primarily utilized by precise micro-machining job shops in industries such as aerospace, military, and medical devices. It is also favored in the pharmaceutical, semiconductor, automotive, and new energy sectors.
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Adaptable to a Wide Range of Materials
Utilizing short-wavelength or ultrafast laser sources, it efficiently processes both organic and non-organic materials. These include metal, glass, ceramic, graphite, plastics, rubber, fiber, and composites.
Integration of Microscope & Micro Motion Stage
The system combines a high-precision motion control stage, operating with 1~5 micron repetition, with a video microscope.
Refinement in Laser Technology
The system enables micro-forming processes inaccessible to traditional mechanical machining or chemical etching methods. It offers solutions for wafer laser marking, annealing, scribing, or dicing. Additionally, it handles tasks such as glass, sapphire, ceramic, and metal grooving or micro-drilling, blind hole drilling, micro 3D forming, and selective layer removal.
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Transform Application Challenges into Added Value
By utilizing this laser micromachining technology, users can overcome various processing challenges with new and special materials. The exceptional capabilities of laser technology enable equipment owners to significantly enhance their return on investment through revenue and margin generation.