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FALIT® IC Laser Decapsulation System for Failure Analysis 2006

The FALIT® IC Laser Decapsulation System for failure analysis has been used since 2006 to reveal bonding wires and dies.

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InstaMark® 2016 New 100-Watt Desktop 3.5 Laser Deep Engraver with XYZ motion extended lasing field

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RETINA® – DIE mark counterfeit verification on silicon wafer after fully laser decapsulation

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